Toshiba Corporation and SanDisk Corporation today announced that they intend to cooperate in the construction of a new 300-millimeter (mm) wafer fabrication facility at Toshiba’s Yokkaichi operations in order to meet growing demand for NAND flash memory. The move is expected to allow mass production in the new facility to be advanced to the second half of Toshiba’s FY2005 from the originally planned FY2006 that Toshiba announced last December. Toshiba currently plans to start construction of the building in the first half of FY2004.
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